The electronics sector has changed significantly in recent years. The lack of components and their long delivery times are some of the main factors causing reductions in production batches, in order to adapt them as far as possible to the available components. At TEF, aware of the current situation, we want to respond quickly and flexibly to our customers so that we can manufacture short batches in the shortest possible time and with a wide mix of different products.
Many manufacturers currently rely on TEF, a specialist in electronic board assembly, as their “technology partner” for the production of their electronic equipment. Our goal with this renewed planning is to be able to meet everyone’s needs.
Growth in SMD assembly
At TEF, we have committed to increasing our production capacity by implementing our fifth SMD line. This is a line with an identical configuration to the previous four, and it helps us to be more flexible, agile and quick in making changes and set-ups.
Each of our SMD electronic board assembly lines consists of:
AT Screen Printing: Solder Paste Printer Mod. AT
SPI 3D: Pemsaturn-4MP – Saturno Inline Solder Paste Inspection
Pick and Place 471: High Speed Flexible Mounter SM471
Pick and Place 482: Multi-Functional Placer SM482 Plus
11-zone oven: Lead-free Reflow Oven with 10 heating zones, model MSTR-1000
AOI 3D: Eagle 8800HSL
Growth in THT assembly
Growth in SMD assembly would not be consistent without corresponding growth in THT assembly. At TEF, we are aware of this, which is why we have implemented two automated high-production THT lines, one configured for selective wave soldering and the other for conventional wave soldering:
Ersa Versaflow 4050 Selective
Ersa Powerflow Pro
These two waves are followed by two other conventional waves of average production.
With the growth of both SMD and THT assembly equipment, we are ensuring our goal: to expand Tef’s capacity to manufacture short batches in order to meet all the needs of our customers.
